Polymer Ceramic Composites For Microwave Applications

Ceramic filled polymer composites are finding increasing applications in electronic and microwave devices since they combine ceramic s electrical properties and the mechanical flexibility chemical stability and processing possibility of polymers polymer ceramic composites with low relative dielectric constant ɛ r 10 and high quality factor q on one hand are.

Polymer ceramic composites for microwave applications.

Interestingly the incorporation of polystyrene ps by the coating route could significantly improve the thermal behaviors of the composites hdpe ps bnt besides the temperature. Ptfe based composites involving ceramics with high. Polymer ceramic composites have also been investigat ed 14 16 recently chen et al 17 reported the microwave dielectric properties of ptfe sio 2 composite and due to its low relative permittivity e r54 which cannot be used for the miniaturization of microwave devices. Polymer ceramic composites were prepared by twin screw melt extrusion with high density polyethylene hdpe as the matrix and polystyrene coated bao nd2o3 tio2 bnt ceramics as the filling material.

In the previous works about high dielectric constant ptfe composites the ba mg 1 3 ta 2 3 o 3 ba 4 2 nd 9 2 ti 18 o 54 teo 2 li 2 mg 3 tio 6 na 0 6 li 0 4 0 5 nd 0 5 tio 3 li 2 tio 3 ceramic powders had been added into the ptfe matrix to fabricate composites for microwave substrate applications 19 20. We present a novel technique to fabricate conformal and pliable substrates for microwave applications including systems on package. Polymer ceramic composites especially type 0 3 are a poten tial group of materials suitable for producing functional packages that combine the electrical properties of ceramics and the mechan. Fabrication and performance assessment abstract.

By incorporating ldpe into the composites via a coating route high ceramic powder volume content up to 50 vol could be achieved. The coefficient of thermal expansion cte of polymer ceramic composites is an important parameter that is used in packaging technology. Polymer ceramic composites for microwave applications. Unique polymer ceramic composites for microwave antenna applications were prepared via melt extrusion using high density polyethylene hdpe as the matrix and low density polyethylene ldpe coated bao nd 2 o 3 tio 2 bnt ceramic powders as the filler.

Microwave packaging technology demands substrate materials with high frequency compatibility minimal dielectric losses low coefficient of thermal expansion and high thermal conductivity. Fabrication and performance assessment january 2007 ieee transactions on microwave theory and techniques 54 12 4202 4208. Polymer ceramic composites for microwave applications. All the works mostly.