Is moisture really a bigger issue with polyimides than with epoxy systems.
Polyimide laminate systems.
Iii laminate what is a laminate.
All polyimide laminates are easy to fabricate into any size shape or design your application requires and is often used in the form of thin flexible flat cables flexible circuits and flexible heaters.
Polyimide laminate and prepreg 85n is the ultimate polyimide and laminate and prepreg system for pwb s requiring resistance to high temperature both in process and in ende a uson batcppomee cr i rheli e finmi esid povtrsyr best in class thermal stability for applications with sustained high in use temperatures as.
All polyimide high temperature bonding film pyralux ht.
How are laminates classified.
What are the most important laminate properties.
85nt combines the high reliability features of polyimide improved pth reliability and temperature stability with the low in plane x y expansion of 6 9 ppm c and outstanding dimensional stability of the aramid reinforcement.
Dupont pyralux ap is an all polyimide double sided copper clad laminate that has excellent thermal chemical and mechanical properties.
What about polyimide prepregs.
Follow future shipping activity from polyimide laminate systems llc.
Its outstanding material properties and high temperature resistance make both extremely low and high temperature applications possible 269 c to 220 c and has a.
Springboro ohio makes the prepreg with low cost mda free polyimide resin formulated by maverick corporation maverick cofounder ceo eric collins explains that this trademarked material system which has a service temperature of 550 f 288 c has been developed in cooperation with ge aviation evendale ohio using.
They have excellent dielectric properties and inherently low coefficient of thermal expansion.
P96 p26 polyimide based prepreg and laminate isola offers a product line of polyimide based prepreg p26 and core material p96 for high temperature printed circuit applications.
Polyimides pis are high temperature engineering polymers originally developed by the dupont company.
Polyimides exhibit an exceptional combination of thermal stability 500 c mechanical toughness and chemical resistance.
Arlon recommends vacuum desiccation of all prepregs prior to use.
These products consist of a flame resistant polyimide resin system suitable for military commercial or industrial electronic applications.
Dupont pyralux ht bonding film can be used in conjunction with pyralux ap to create a complete all polyimide flex laminate system that includes a double sided copper clad laminate and a unique all polyimide coverfilm or bonding material that becomes a flexible coverlay after processing.
It is ideal for use in rigid flex and multilayer flex applications which require advanced performance such as low dissipation loss for high speed high frequency thermal resistance and high reliability.
